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250 °C-Operated sandwich-structured all-SiC power module

https://aist.repo.nii.ac.jp/records/2001803
https://aist.repo.nii.ac.jp/records/2001803
05d8a688-9650-4475-9281-8d140d4c802e
Item type Research Data (v9)(1)
PubDate 2015-01-01
Data name
Title 250 °C-Operated sandwich-structured all-SiC power module
Language en
Description of data
Description Type Abstract
Description The operation of a sandwich structured all-SiC power module is demonstrated at 250 °C. The power module was designed by considering two thermal deformation issues. Thermally induced bending of the SiN-AMC substrates is reduced by introducing symmetrical Cu wiring patterns on both sides of the SiN ceramic plate. The concentration of stress located in the gate joint material is drastically reduced by introducing a trench structure in the Cu wiring layer of the gate interconnection. A double pulse test at a high temperature is carried out. At 250 °C, the all-SiC sandwich-structured power module was successfully operate at 600V and 15A. The maximum switching transient speed (dV/dt) of turn-on and turn-off are observed 10.7 and 12.1 V/ns, respectively.
Language en
Author (Creator) name 加藤 史樹

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en 加藤 史樹
加藤 史樹

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Simanjorang Rejeki

× Simanjorang Rejeki

en Simanjorang Rejeki
Simanjorang Rejeki

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郎 豊群

× 郎 豊群

en 郎 豊群
郎 豊群

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仲川 博

× 仲川 博

en 仲川 博
仲川 博

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山口 浩

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en 山口 浩
山口 浩

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Access Rights
Access Rights open access
Access Rights URI http://purl.org/coar/access_right/c_abf2
APC
APC Not required
Rights Holder
Right Holder Name 加藤 史樹
Language en
Publisher
Publisher IOP PUBLISHING LTD
Language en
Date
Date 2015-01-01
Date Type Issued
Language
Language eng
Resource Type
Resource Type Identifier http://purl.org/coar/resource_type/c_6501
Resource Type journal article
Identifier
Identifier 10.7567/JJAP.54.04DP06
Identifier Type DOI
Relation
Relation Type isVersionOf
Identifier Type URI
Related Identifier http://iopscience.iop.org/article/10.7567/JJAP.54.04DP06/meta
Language ja
Related Title 関連 URI
Source Title
Source Title JAPANESE JOURNAL OF APPLIED PHYSICS
Language en
Volume Number
Volume 54
Issue Number
Issue 04DP06
Page Start
Start Page 1
Page End
End Page 5
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